Lurie Nanofabrication Facility (LNF)

provides advanced micro- and nano-fabrication equipment and expertise to enable cutting edge research.

Contacts

Sandrine Martin, PhD
734-277-2365
info@LNF.umich.edu

Location

Electrical & Computer Engineering (EECS) Building
1301 Beal Ave, Ann Arbor, MI

Affiliations
Engineering

Who We Serve

University of Michigan Researchers and External Researchers

Core Summary

The University of Michigan Lurie Nanofabrication Facility (LNF) is a state-of-the-art shared clean-room facility, which provides advanced micro- and nano-fabrication equipment and expertise to enable cutting edge research, from semiconductor materials and devices, biotechnology, medical devices, solid-state lighting, energy and unconventional materials and processing technologies. Technical staff members support the LNF facilities, programs and user community, provide key expertise to advise researchers with their projects and allow the LNF to offer process services.

Service Categories: Engineering

Services

Onsite Access
24/7 hands-on independent access to micro/nanofabrication equipment and capabilities,

Process Services
Fabrication Provided by LNF Staff,


Equipment

Annealing
Convection-Polyimide Oven, YES Vacuum Oven,

Bio Room
BSL-2,

Furnaces-Atmospheric
Angstrom Eng furnace, S1/T1: anneal 4" and 6", S3/T1: dry oxidation 4" and 6", S3/T2: wet oxidation 4" and 6", S5/T1: P diffusion 4", S5/T2: P anneal/oxidation 4", S5/T3: B diffusion 4", S5/T4: B anneal/oxidation 4", S6/T1: Anneal non-CMOS,

Furnaces-LPCVD
S1/T2: LTO 4", S1/T3: PolySi 6", S1/T4: LTO 6", S2/T2: Nitride/HTO 6", S2/T3: Nitride/HTO/oxynitride 4", S2/T4: LS Nitride 4", S3/T3: PolySi 4", S3/T4: n-type in-situ doped polySi 4", S4/T2: PSG 4", S4/T3: p-type in-situ doped polySi 4", S4/T4: TEOS 4", S6/T2: Nitride/HTO/oxynitride non-CMOS, S6/T3: PolySi non CMOS, S6/T4: LTO non CMOS,

Lithography
ACS 200 Cluster Tool, CEE 100CB Spinner, CEE 200X Spinner #1, CEE Developer #1, CEE Developer #2, Dimatix Inkjet Printer, GCA AS200 Stepper, Glenn 1000P Plasma Cleaner, Heidelberg uPG501 Mask Maker, JEOL E-beam JBX6300 FS, MA/BA-6 Mask/Bond Aligner, MA6 Mask Aligner, MJB 45S Aligner, MJB3 #1 Aligner, MJB3#2 Aligner, NanoInk DPN5000, YES Image Reversal,

Metrology
Agilent uFTIR, Dektak 6M Surface Profilometer, Dektak XT Surface Profilometer, Flexus 2320-S, ICON AFM, IR Microscope, Nanospec 6100, Olympus BX-51 Fluorescent Microscope, Olympus LEXT Interferometer, Rame-Hart Goniometer, SEM In-line, Woollam M-2000 Ellipsometer, Zygo NewView 5000,

Other Specialty Equipment
Jetfirst-100 Forming RTP, Jetfirst-150 RTP, PDS 2035 Parylene, Tousimis critical point dryer CPD,

Physical Vapor Deposition (PVD)
AE Evaporator, Cooke Evaporator, Enerjet Evaporator, Lab18_01 Sputter, Lab18_02 Sputter, PVD75 Sputter, SJ-20 Evaporator, SJ-26 Evaporator, Tegal A|N Sputter,

Plasma Enhanced Chemical Vapor Deposition (PECVD)
GSI PECVD, Oxford ALD, P5000 PECVD, Plasmatherm 790 PECVD/RIE,

Polishing and Mechanical
ADT 7100 Dicing Saw, CMP Strasbaugh 6EC, Flip Chip Bonder, Lapper Logitech PM5, SSEC Wafer Cleaner, Wire Bonder K&S 4123,

Reactive Ion Etching (RIE) and Plasma Etch
LAM 9400 RIE, Oxford ICP RIE, P5000 RIE, STS Deep Glass Etcher, STS Pegasus 4 DRIE, STS Pegasus 6 DRIE, Xactix XeF2, YES Plasma Stripper,

Wafer Bonding
CL-200 Megasonic Cleaner, EVG 510 Bonder, EVG 520IS Bonder, EVG 620 Bond Aligner, nP12 Nanoprep, Suss SB-6E Bonder,

Wet Benches
Acid Bench 02, Acid Bench 12, Acid Bench 23, Acid Bench 72, Acid Bench 73, Acid Bench 82, Acid Bench 92, Base Bench 63, Base Bench 91, E-Beam Solvent Bench 22, E-Beam Spinner Bench 21, EDP Bench 93, Gold Plating Station 61, Mask Bench 13, PFC Bench 01 (per run), RCA Clean Bench 82 (per run), Solvent Bench 14, Solvent Bench 83, Solvent Bench 84, Solvent Bench 94,